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MT9T031: 1/2-Inch 3-Mp Digital Image Sensor
Package Dimensions
Package Dimensions
Figure 8:
D
48-Pin PLCC
2.25 FOR
REFERENCE
SEATING
PLANE
A
ONLY
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
LID MATERIAL: BOROSILICATE GLASS 0.55 THICKNESS
13.00
CTR
47X 0.90
1.90
11.176
1.016
TYP
C
B
7.188 ±0.075
OPTICAL CENTER
0.078 FOR
REFERENCE ONLY
OPTICAL CENTER
48
1
48X 0.50
11.176
C L
6.56
7.11 ±0.05
14.220 ±0.075
6.176 ±0.075
OPTICAL CENTER
13.00
CTR
5.588
1.016
TYP
0.934 FOR
REFERENCE ONLY
PACKAGE CENTER
C L
5.588 6.56
7.11 ±0.05
14.220 ±0.075
LEAD FINISH:
GOLD PLATING,
0.50 MICRONS
MINIMUM THICKNESS
1.050 ±0.075
0.500 FOR
REFERENCE ONLY
1.200 ±0.075
OPTICAL
AREA
DIE AND
PACKAGE
CENTER
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES B AND C : 1o
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A : 50 MICRONS
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS D : 50 MICRONS
Notes:
1. All dimensions in millimeters.
PDF: 09005aef824c997f/Source: 09005aef824c998a
MT9T031_3100_PB_2.fm - Rev. A 8/06 EN
10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
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